Choosing between the Jetson Orin NX and the Jetson Orin Nano for an edge AI product is usually a performance-vs-cost decision. But the choice also changes your enclosure and cooling design. This guide compares the two modules from a hardware-integrator perspective: what each needs thermally, what it means for your chassis, and where the real cost differences hide.
The Short Answer
The Orin Nano runs cool enough that a compact fanless enclosure with a simple heatsink base is usually sufficient. The Orin NX, at higher power modes, needs a larger fin area or an active cooling kit to hold sustained performance in warm ambients. Plan the enclosure for the module you pick — do not assume one chassis fits both.
Key Differences That Drive Enclosure Design
- Thermal envelope: the Orin Nano has a lower TDP and can be passively cooled in most indoor environments; the Orin NX needs more surface area or airflow at high loads.
- Form factor: Orin Nano modules are smaller, so a compact box with a machined base plate is enough; Orin NX boards and heatsinks require a taller chassis.
- I/O and antennas: carrier boards differ, so cutouts for ports, antennas and mounting brackets must match your specific carrier, not just the module.
- Cost of cooling: an active cooling kit adds a fan and BOM cost; the Orin Nano can often avoid it entirely.
When Fanless Works for Each
Orin Nano — fanless is the default
For typical indoor deployments (machine vision, gateways, kiosks), a fanless aluminum enclosure with a heatsink base handles the Orin Nano comfortably, with margin for warm ambients.
Orin NX — depends on the workload
Bursty workloads in a controlled room are fine fanless with adequate fin area. Continuous high-load inference in warm environments (40°C+) pushes toward a larger passive heatsink or an active cooling kit. If you are unsure, size for the worst case and validate with a thermal test.
Practical Sizing Checklist
- Confirm the module's TDP and your worst-case ambient temperature.
- Send the carrier board drawing (STEP/IGS) for a DFM review before tooling.
- Decide on fanless vs active up front — retrofitting a fan into a sealed fanless chassis is expensive.
- Reserve fin clearance: passive cooling needs free space above the fins for convection.
- Request a thermal test report on the first article, not an estimate.