Frequently Asked Questions

Our enclosures and cooling kits are designed to be compatible with the Jetson Orin NX, Orin Nano, Xavier NX and AGX Orin (32/64GB) class compute modules. Please confirm your exact carrier board so we can match cutouts, mounting and thermal footprint in the DFM review.

No. Jeviwix manufactures enclosures and thermal management kits only. We do not sell NVIDIA modules, carrier boards or compute boards, and we are not affiliated with or endorsed by NVIDIA.

Fanless kits use an aluminum heatsink chassis with no moving parts — best for reliability and silence in indoor edge AI. Active kits add a copper heat-pipe heatsink and PWM industrial fan for higher sustained power. Liquid kits use a cold plate, pump and radiator for the highest sustained heat removal in sealed or warm environments. See our cooling comparison guide.

A typical fanless aluminum enclosure dissipates up to about 45W passively, depending on fin area, orientation and ambient temperature. For warm environments or higher power, move up to an active or liquid kit. We provide thermal test reports to confirm your specific configuration.

Fanless enclosures operate in roughly -20°C to +60°C, active cooling kits in -25°C to +65°C, and liquid-cooling kits in -10°C to +70°C (coolant dependent). Final limits depend on the module and workload — confirm with a thermal test for your environment.

Choose passive for low-to-moderate power in clean, indoor environments where silence and zero maintenance matter. Choose active when you need higher sustained power and acceptable fan noise. Choose liquid when you need sustained full-load performance in sealed or high-temperature cabinets.

Thermal throttling happens when the module exceeds its temperature limit. Prevent it by sizing the cooling solution for your worst-case ambient (not the lab average), keeping the thermal path clean (module → TIM → base plate → fins), and validating with a 24-hour soak test at rated power.

Yes. Thermal test reports with measured module temperatures are available on request, and pressure-test records are shipped with liquid-cooling kits. Test documentation accompanies every order.

We offer IP30 for clean indoor use, IP54 as the industrial default (dust-protected and splash-proof), and up to IP65/IP66 for harsh outdoor environments. Higher IP ratings require a conduction-based thermal design, which we can engineer for you.

Standard is aluminum alloy with black anodizing for heat radiation and corrosion resistance. We also offer clear anodize, powder coating and custom colors, plus copper base plates or heat pipes where higher conduction is needed.

Yes. Send your carrier board drawing (STEP/IGS/DWG) or a rough sketch. Our engineers run a DFM review to confirm manufacturability, fit and thermal performance before sampling. Custom cutouts, mounting brackets, I/O windows and branding are all supported.

Yes, that is our core service. We accept STEP/IGS/DWG files or sketches, run a DFM review, and confirm materials, cost and manufacturability before sampling. First-article samples are typically ready in 3-7 working days.

Stock designs start from 10 units. Custom ODM orders also start from 10 units, and liquid-cooling kits have an MOQ of 20 units. We are built for startups and integrators that big factories ignore.

Samples: 3-7 working days for enclosures, 5-8 days for active kits, 7-10 days for liquid kits. Mass production: 12-18 days for fanless, 15-22 days for active, 20-28 days for liquid cooling kits.

Enclosure dimensions and cutouts, material and thickness, surface finish (anodize/powder coat), mounting options (DIN-rail, VESA, wall, pole), silk-screen logo, packaging, and cooling loop layout for liquid kits. See the ODM page for details.

We run a four-stage QC flow: IQC (incoming material), IPQC (in-process during fabrication and assembly), FQC (final dimensional and finish check) and OQC (outgoing inspection with pressure-test records for liquid kits).

CE, ISO 9001:2015 and RoHS compliance documents are available on request. Thermal test reports and pressure-test records are also provided with orders. Sample certificates are for demonstration only; final documentation is delivered upon project confirmation.

CE certification covers EMC and safety for the European market, and RoHS addresses hazardous substances. Combined with your own conformity assessment, our documentation supports EU market entry. Confirm the exact requirements for your product category.

Send your drawings or a description of the module and carrier board, target quantity, and any special requirements (IP rating, mounting, finish). With that we provide unit price, tooling cost and lead time within 24 business hours.

Standard payment terms are T/T (typically 30% deposit, 70% before shipment) or L/C for larger orders. We ship by air or sea via FOB/Jinan or DDP for eligible regions. Delivery terms are confirmed in the quotation.